Equipment

 

1. Seed Slabbing Machine

Dedicated for assemby of sapphire crystal and cutting of sapphire seed plate.

  • With special blade
  • High speed of cutting
  • Assembly process is safe
  • Angle of cutting table is adjustable
  • Chinese interface operation system

 

2. Seed Striping Machine

Dedicated for assemby of sapphire crystal and cutting of sapphire seed bar.

  • With special blade
  • High speed of cutting
  • Assembly process is safe
  • Able to cut 6-7 sapphire seed bars at the same time
  • Chinese interface operation system

 

4. C Axis Sapphire Growing Furnace

According to customer's needs, we could provide the furnace with different growth direction of Sapphire.

  • Furnace manufacurer possess the patented growing technology
  • High yield rate
  • Utilization rate of grown sapphire is high
  • Upon needs of different size, different specification of Furnace is available
  • According to customer's need, growth direction can be adjusted
  • Widely used in differnet fields such as LED substrate and cell phone panels

 

5. Sapphire Boule Cutting Machine

Dedicated for assemby of sapphire crystal, cutting against 85KG sapphire boule.

  • With special blade
  • High speed of cutting
  • Assembly process is safe
  • No damege to sapphire
  • Chinese interface operation system

 

6. Rough Grinding Machine

Dedicated for assemby of sapphire crystal, rough grinding and adjust for cutting surface of sapphire sphere.

  • With special gringing disc
  • Assembly process is safe
  • No damage to sapphire
  • Simple operation

 

7. Coring Machine

Dedicated for the coring of synthetic sapphire.。

  • Fast coring speed
  • Good coring quality
  • No damage to sapphire
  • High yield rate
  • Apply for 2" 4" 6"8" size ignot
  • Chinese interface operation system

 

8. Cutting Machine (Sawing Machine)

Dedicated for assemby of sapphire crystal, cutting the head and tail of ignot.

  • High speed of cutting
    • Cutting time of 2" ignot is around 6 minutes/cut
    • Cutting time of 4" ignot is around 12 minutes/cut
    • Cutting time of 6" ignot is around 25 minutes/cut
  • Good quality of cutting
  • High efficiency
  • High yield rate
  • Chinese interface operation system

 

9. Rounding Machine

Use for grinding of outer surface of sapphire ignot, rounding and assembly the ignot which head and tail is cut

  • High speed of grinding
  • Good quality of grinding
  • High yield rate
  • Apply for 2" 4" 6"8" size ignot
  • Chinese interface operation system

 

10. Reference Plane Grinding Machine

Grinding of orientation side (reference side) to prepare for the cutting and fixing works afterward

  • High speed of grinding
  • Good result in flat grinding
  • High yield rate
  • Able for the grinding of 2" 4" 6" 8" ignot
  • Chinese interface operation system

 

11. Ingot Bevelling Machine

Dedicated for assemby of sapphire crystal, preform ignot bevelling after cutting the head and tail of ignot.

  • High speed of processing
  • Good quality of processing
  • High efficiency
  • High yield rate

 

13. Multi Wire Saw

Mass production sawing machine dedicated for extramely hard materials such as sapphire.

  • Spindle Rocking Slicing (Retaining patent at worldwide)
  • Mature diamond wire cutting process
  • High speed slicing
  • High Rigidity Spindle supports high sawing tension
  • Maximum sawing size up to 8 inch
  • Some models are with auto wire wind system (Exclusive function)

 

16. Auto Sorter - Wafer Thickness

Perform measuring and sorting of sapphire wafer during slicing and lapping

  • Non-contact laser sensor by Japan Keyence
  • Measure for sapphire wafer thickness, TTV, TV5, BOW
  • Analyse and calculate the measurement data by computer to save manpower
  • Precise measurement to achieve the objective of quality control
  • Cover is available for machine to prevent secondary pollution

 

19. Cleaner - Before Annealing

  • Semi-automatic operation, high safety level
  • Stable structure, low failure rate and easy to maintenance
  • Easy to convert among 2 inch, 4 inch and 6 inch production line
  • Automatic dispensing precisely
  • Numbers of safety design

 

20. Spin Dryer

For the drying of wafer after cleaning

  • Compact design and small footprint
  • Simple operation interface
  • Production process is progammable
  • Easy maintenance
  • Stable and reliable performance
  • High efficient production
  • Specially designed turntable is optional
  • According to the size of wafer box, customize design on rotor part is available.
  • Vertical and horizontal type is available for customers.

 

21. Anneal Oven

An aerobic anneal oven for the removal of stress which generated at the processing of substrate.

  • Using imported heating element
  • Using Japanese high end aluminum oxide fiber board which is fireproof and thermal insulation
  • Using British temperture control system
  • Simple operation with stable, safety and reliable performance
  • Suitable for annealing of 2 inch, 4 inch and 6 inch wafer

 

23. Wafer Thickness Meansurement Machine

Measuring the thickness of wafer after waxing on plate by non-touched laser detector

  • Non-touched laser detector by Japan Keyence
  • Measuring the thickness of wafer after waxing on plate
  • Analysing and calculating measured data by computer to save manpower
  • Precise measurement to achieve the objective of quality control
  • Cover is available for machine to prevent secondary pollution

 

25. Dewax Cleaner

Cleaning residual on wafer and copper plate after polishing

  • Semi-automatic operation, high safety level
  • Stable structure, low failure rate and easy to maintenance
  • Easy to convert among 2 inch, 4 inch and 6 inch production line
  • Automatic dispensing precisely
  • Numbers of safety design

 

26. Spin Dryer

For the drying of wafer after cleaning

  • Compact design and small footprint
  • Simple operation interface
  • Production process is progammable
  • Easy maintenance
  • Stable and reliable performance
  • High efficient production
  • Specially designed turntable is optional
  • According to the size of wafer box, customize design on rotor part is available.
  • Vertical and horizontal type is available for customers.

 

29. Cleaner - After Polishing

Cleaning residue of wafer after polishing

  • Semi-automatic operation, high safety level
  • Stable structure, low failure rate and easy to maintenance
  • Easy to convert among 2 inch, 4 inch and 6 inch production line
  • Automatic dispensing precisely
  • Numbers of safety design

 

30. Spin Dryer

For the drying of wafer after cleaning

  • Compact design and small footprint
  • Simple operation interface
  • Production process is progammable
  • Easy maintenance
  • Stable and reliable performance
  • High efficient production
  • Specially designed turntable is optional
  • According to the size of wafer box, customize design on rotor part is available.
  • Vertical and horizontal type is available for customers.

 

32. Double Side Scrubber

Scrubbing impurities attachments of wafer after polishing and cleaning and perform cleaning again

  • Stable structure, low failure rate and easy to maintenance
  • Easy to convert among 2 inch, 4 inch and 6 inch production line
  • Automatic dispensing precisely
  • Numbers of safety design

 

33. Final Cleaner

For final cleaning of wafer

  • 半自Semi-automatic operation, high safety level
  • Stable structure, low failure rate and easy to maintenance
  • Easy to convert among 2 inch, 4 inch and 6 inch production line
  • Automatic dispensing precisely
  • Numbers of safety design

 

34. Spin Dryer

For the drying of wafer after cleaning

  • Compact design and small footprint
  • Simple operation interface
  • Production process is progammable
  • Easy maintenance
  • Stable and reliable performance
  • High efficient production
  • Specially designed turntable is optional
  • According to the size of wafer box, customize design on rotor part is available.
  • Vertical and horizontal type is available for customers.

 

35. Automatic Laser Marker

The laser marker from Taiwan which the market share is 100% in LED industry

  • High yield rate
  • Able to mark SEMI DOT and Line fonts
  • Configuring HEPA to filter dust particles
  • Able for marking on 2 inch, 4 inch and 6 inch of single, double, front and back side
  • Configuring safety devices such as UPS, mechanical arm, sucker lock
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