Process of Semiconductor Optoelectronic
As the production flow of customers is different, below flow chart is just for reference.
Other than the machines shown at this page, we could provide suitable machine according to your needs.
Equipment
1. Seed Slabbing Machine
Dedicated for assemby of sapphire crystal and cutting of sapphire seed plate.
- With special blade
- High speed of cutting
- Assembly process is safe
- Angle of cutting table is adjustable
- Chinese interface operation system
2. Seed Striping Machine
Dedicated for assemby of sapphire crystal and cutting of sapphire seed bar.
- With special blade
- High speed of cutting
- Assembly process is safe
- Able to cut 6-7 sapphire seed bars at the same time
- Chinese interface operation system
4. C Axis Sapphire Growing Furnace
According to customer's needs, we could provide the furnace with different growth direction of Sapphire.
- Furnace manufacurer possess the patented growing technology
- High yield rate
- Utilization rate of grown sapphire is high
- Upon needs of different size, different specification of Furnace is available
- According to customer's need, growth direction can be adjusted
- Widely used in differnet fields such as LED substrate and cell phone panels
5. Sapphire Boule Cutting Machine
Dedicated for assemby of sapphire crystal, cutting against 85KG sapphire boule.
- With special blade
- High speed of cutting
- Assembly process is safe
- No damege to sapphire
- Chinese interface operation system
6. Rough Grinding Machine
Dedicated for assemby of sapphire crystal, rough grinding and adjust for cutting surface of sapphire sphere.
- With special gringing disc
- Assembly process is safe
- No damage to sapphire
- Simple operation
7. Coring Machine
Dedicated for the coring of synthetic sapphire.。
- Fast coring speed
- Good coring quality
- No damage to sapphire
- High yield rate
- Apply for 2" 4" 6"8" size ignot
- Chinese interface operation system
8. Cutting Machine (Sawing Machine)
Dedicated for assemby of sapphire crystal, cutting the head and tail of ignot.
- High speed of cutting
- Cutting time of 2" ignot is around 6 minutes/cut
- Cutting time of 4" ignot is around 12 minutes/cut
- Cutting time of 6" ignot is around 25 minutes/cut
- Good quality of cutting
- High efficiency
- High yield rate
- Chinese interface operation system
9. Rounding Machine
Use for grinding of outer surface of sapphire ignot, rounding and assembly the ignot which head and tail is cut
- High speed of grinding
- Good quality of grinding
- High yield rate
- Apply for 2" 4" 6"8" size ignot
- Chinese interface operation system
10. Reference Plane Grinding Machine
Grinding of orientation side (reference side) to prepare for the cutting and fixing works afterward
- High speed of grinding
- Good result in flat grinding
- High yield rate
- Able for the grinding of 2" 4" 6" 8" ignot
- Chinese interface operation system
11. Ingot Bevelling Machine
Dedicated for assemby of sapphire crystal, preform ignot bevelling after cutting the head and tail of ignot.
- High speed of processing
- Good quality of processing
- High efficiency
- High yield rate
13. Multi Wire Saw
Mass production sawing machine dedicated for extramely hard materials such as sapphire.
- Spindle Rocking Slicing (Retaining patent at worldwide)
- Mature diamond wire cutting process
- High speed slicing
- High Rigidity Spindle supports high sawing tension
- Maximum sawing size up to 8 inch
- Some models are with auto wire wind system (Exclusive function)
16. Auto Sorter - Wafer Thickness
Perform measuring and sorting of sapphire wafer during slicing and lapping
- Non-contact laser sensor by Japan Keyence
- Measure for sapphire wafer thickness, TTV, TV5, BOW
- Analyse and calculate the measurement data by computer to save manpower
- Precise measurement to achieve the objective of quality control
- Cover is available for machine to prevent secondary pollution
19. Cleaner - Before Annealing
- Semi-automatic operation, high safety level
- Stable structure, low failure rate and easy to maintenance
- Easy to convert among 2 inch, 4 inch and 6 inch production line
- Automatic dispensing precisely
- Numbers of safety design
20. Spin Dryer
For the drying of wafer after cleaning
- Compact design and small footprint
- Simple operation interface
- Production process is progammable
- Easy maintenance
- Stable and reliable performance
- High efficient production
- Specially designed turntable is optional
- According to the size of wafer box, customize design on rotor part is available.
- Vertical and horizontal type is available for customers.
21. Anneal Oven
An aerobic anneal oven for the removal of stress which generated at the processing of substrate.
- Using imported heating element
- Using Japanese high end aluminum oxide fiber board which is fireproof and thermal insulation
- Using British temperture control system
- Simple operation with stable, safety and reliable performance
- Suitable for annealing of 2 inch, 4 inch and 6 inch wafer
23. Wafer Thickness Meansurement Machine
Measuring the thickness of wafer after waxing on plate by non-touched laser detector
- Non-touched laser detector by Japan Keyence
- Measuring the thickness of wafer after waxing on plate
- Analysing and calculating measured data by computer to save manpower
- Precise measurement to achieve the objective of quality control
- Cover is available for machine to prevent secondary pollution
25. Dewax Cleaner
Cleaning residual on wafer and copper plate after polishing
- Semi-automatic operation, high safety level
- Stable structure, low failure rate and easy to maintenance
- Easy to convert among 2 inch, 4 inch and 6 inch production line
- Automatic dispensing precisely
- Numbers of safety design
26. Spin Dryer
For the drying of wafer after cleaning
- Compact design and small footprint
- Simple operation interface
- Production process is progammable
- Easy maintenance
- Stable and reliable performance
- High efficient production
- Specially designed turntable is optional
- According to the size of wafer box, customize design on rotor part is available.
- Vertical and horizontal type is available for customers.
29. Cleaner - After Polishing
Cleaning residue of wafer after polishing
- Semi-automatic operation, high safety level
- Stable structure, low failure rate and easy to maintenance
- Easy to convert among 2 inch, 4 inch and 6 inch production line
- Automatic dispensing precisely
- Numbers of safety design
30. Spin Dryer
For the drying of wafer after cleaning
- Compact design and small footprint
- Simple operation interface
- Production process is progammable
- Easy maintenance
- Stable and reliable performance
- High efficient production
- Specially designed turntable is optional
- According to the size of wafer box, customize design on rotor part is available.
- Vertical and horizontal type is available for customers.
32. Double Side Scrubber
Scrubbing impurities attachments of wafer after polishing and cleaning and perform cleaning again
- Stable structure, low failure rate and easy to maintenance
- Easy to convert among 2 inch, 4 inch and 6 inch production line
- Automatic dispensing precisely
- Numbers of safety design
33. Final Cleaner
For final cleaning of wafer
- 半自Semi-automatic operation, high safety level
- Stable structure, low failure rate and easy to maintenance
- Easy to convert among 2 inch, 4 inch and 6 inch production line
- Automatic dispensing precisely
- Numbers of safety design
34. Spin Dryer
For the drying of wafer after cleaning
- Compact design and small footprint
- Simple operation interface
- Production process is progammable
- Easy maintenance
- Stable and reliable performance
- High efficient production
- Specially designed turntable is optional
- According to the size of wafer box, customize design on rotor part is available.
- Vertical and horizontal type is available for customers.
35. Automatic Laser Marker
The laser marker from Taiwan which the market share is 100% in LED industry
- High yield rate
- Able to mark SEMI DOT and Line fonts
- Configuring HEPA to filter dust particles
- Able for marking on 2 inch, 4 inch and 6 inch of single, double, front and back side
- Configuring safety devices such as UPS, mechanical arm, sucker lock